this is information on a product in full production. march 2016 docid028878 rev 1 1/7 EMIF06-HMC02F2 6-line ipad?, emi filter including esd protection datasheet - production data features ? 6 lines low-pass-filter ? high efficiency in emi filtering ? very low pcb space consuming: < 4 mm2 ? lead-free package ? very thin package: 0.65 mm ? high efficiency in esd suppression ? high reliability offered by monolithic integration ? high reducing of parasitic elements through integration and wafer level packaging complies with the following standards ? iec 61000-4-2 level 4 on external pins ? 15 kv (air discharge) ? 8 kv (contact discharge) ? mil std 883e - method 3015-6 class 3 applications ? high speed multimediacard ? description the EMIF06-HMC02F2 is a highly integrated array designed to suppress emi / rfi noise for high speed multimediacard ? port filtering. the EMIF06-HMC02F2 flip-chip packaging means the package size is equal to the die size. additionally, this filter includes an esd protection circuitry which prevents the protected device from destruction when subjected to esd surges up to 15 kv. compared to emif06-hmc01f2, the EMIF06-HMC02F2 has its ground balls connected togeth er internally. figure 1. pin confi guration (ball side) figure 2. basic cell configuration tm : ipad is a trademark of stmicroelectronics. ) o l s & k l s s d f n d j h e x p s v table 1. ball configuration a1 cmd c1 dat2 a2 clk c2 gnd a3 vmmc/vdd c3 mmcdat1 a4 mmcclk c4 mmcdat0 b1 dat1 d1 dat3 b2 dat0 d2 gnd b3 gnd d3 mmcdat3 b4 mmccmd d4 mmcdat2 % & ' $ 5 5 5 5 5 5 5 5 5 5 5 9 p p f 0 0 & f o n * 1 ' 0 0 & f p g 0 0 & g d w 0 0 & g d w 0 0 & g d w 0 0 & g d w 9 p p f f o n f p g g d w g d w g d w g d w www.st.com
electrical characteristics EMIF06-HMC02F2 2/7 docid028878 rev 1 1 electrical characteristics figure 3. electrical characteristics (definitions) table 2. absolute maximum ratings (t amb = 25 c) symbol parameter and test conditions value unit v pp internal pins (a4, b4, c3, c4, d3, d4): esd discharge iec61000-4-2, air discharge esd discharge iec61000-4-2, contact discharge external pins (a1, a2, a3, b1, b2, c1, d1): esd discharge iec61000-4-2, air discharge esd discharge iec61000-4-2, contact discharge 2 2 15 8 kv t j maximum junction temperature 125 c t op operating temperature range - 40 to + 85 c t stg storage temperature range - 55 to + 150 c table 3. electrical characteristics (t amb = 25 c) symbol test conditions tolerance min. typ. max. unit v br i r = 1 ma 6 v i rm v rm = 3 v 0.1 a c line v bias = 0 v, v osc = 30 mv, f = 1 mhz 20 pf r 2, r 3, r 4, r 5, r 6, r 7 i = 50 ma 20% 50 ? r 10, r 11, r 12, r 13 i = 50 a 30% 75 k ? r 14 i = 200 a 30% 7 k ? 6 \ p e r o 3 d u d p h w h u 9 % u h d n g r z q y r o w d j h , / h d n d j h f x u u h q w 9 6 w d q g r i i y r o w d j h % 5 5 0 5 0 & / l q h f d s d f l w d q f h o l q h 9 % 5 9 % 5 9 5 0 9 5 0 , 5 0
docid028878 rev 1 3/7 EMIF06-HMC02F2 electrical characteristics 7 figure 8. junction capacitance versus reverse voltage applied (typical values) figure 4. attenuation versus frequency figure 5. analog crosstalk versus frequency 0 0 0 0 * * & p g 0 0 & & p g 6 g % ) + ] ' d w 0 0 & ' d w ' d w 0 0 & ' d w & o n 0 0 & & o n ' d w 0 0 & ' d w ' d w 0 0 & ' d w & o n 0 0 & & p g ; 7 d o n g % ) + ] ' d w 0 0 & ' d w n 0 0 0 * figure 6. esd response to iec61000-4-2 (+8 kv contact discharge) figure 7. esd response to iec61000-4-2 (-8 kv contact discharge) 9 g l y 9 9 9 q v g l y 9 9 g l y 9 q v g l y 9 9 9 & o l q h s ) 9 % , $ 6 9 9 r v f p 9 ) 0 + ] 7 d ? &
package information EMIF06-HMC02F2 4/7 docid028878 rev 1 2 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. 2.1 flip-chip pa ckage information figure 9. flip-chip package outline p p ? ? p p p ? ? p ? p ? ? p ? ? p ? ? p ? ? p ? p
docid028878 rev 1 5/7 EMIF06-HMC02F2 package information 7 2.2 packing information figure 10. tape and reel outline ' r w l g h q w l i \ l q j 3 l q $ o r f d w l r q 8 v h u g l u h f w l r q r i x q u h h o l q j $ o o g l p h q v l r q v l q p p ? [ [ [ \ z z 6 7 ( [ [ [ \ z z 6 7 ( [ [ [ \ z z 6 7 ( figure 11. footprint figure 12. marking & r s s h u s d g ' l d p h w h u ? p u h f r p p h q g h g ? p p d [ 6 r o g h u v w h q f l o r s h q l q j ? p 6 r o g h u p d v n r s h q l q j u h f r p p h q g d w l r q ? p p l q i r u ? p f r s s h u s d v g l d p h w h u [ \ [ z ] z ( ' r w 6 7 o r j r [ [ p d u n l q j \ z z g d w h f r g h \ \ h d u z z z h h n ] s d f n d j l q j o r f d w l r q
ordering information EMIF06-HMC02F2 6/7 docid028878 rev 1 3 ordering information figure 13. ordering information scheme note: more information are available in the application notes: an1235:"flip chip: package description and recommendations for use" 4 revision history table 4. ordering information order code marking package weight base qty delivery mode EMIF06-HMC02F2 lk flip chip 5.3 mg 5000 tape and reel 7? ( 0 , ) \ \ [ [ [ ] ] ) [ ( 0 , ) l o w h u 1 x p e h u r i o l q h v , q i r u p d w l r q 3 d f n d j h [ u h v l v w d q f h y d o x h r k p v ] f d s d f l w d q f h y d o x h s ) r u o h w w h u v d s s o l f d w l r q g l j l w v y h u v l r q ) i o l s f k l s [ o h d g i u h h s l w f k ? p e x p s ? p table 5. document revision history date revision changes 02-mar-2016 1 initial release.
docid028878 rev 1 7/7 EMIF06-HMC02F2 7 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2016 stmicroelectronics ? all rights reserved
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